CAIG SILICONE-BASED HEAT SINK COMPOUND

Description Silicone Heat Sink Compound 6g Squeeze Tube Transfer Heat Away from Electronic Components and Parts Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal bridge to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). USE: Apply to all mounting and threaded surfaces of the device and chassis. CONTAINS: Zinc oxide and polydimethyl siloxane. Specifications Thermal Conductivity: 0.67 Watts per meter K Specific Gravity: 2.1 @25°C Silicone and Zinc Oxides Viscosity: 542000 maps Shelf Life: 60 months Applications Transfer heat away from heat sinks, transistors, power diodes, semiconductors ballasts & thermocouple wells. . Made in China.

FEATURES

• Package Dimensions: 3 L x 0.5 H x 0.5 W (inches)
• Package Weight : 0.06 pounds
• Country of Origin : China
• Part number: HSC67-6G